Vol 288 NIKKEI MICRODEVICES June 2009

Cover Story : Optical interconnection on electronic equipment
Special Feature : Finding signs of applications for carbon materials in electronic devices
LSI
* Report ArF water immersion lithography and double patterning nearing practical use
* Report Fujitsu’s semiconductor may survive alone
FPD
* Inside Consumer circumstances in China behind the expectations to boost domestic demand
* Report SANYO’s projector strategy opens up a new use of display
Energy
* Report Solar-cell chip market expands to about 600 million US dollars in 2013
Tutorial FPD
FPD industry at a turning point(5)
MEMS
* Inside ST Microelectronics talks about technologies of camera modules stacked with TSV
Tutorial Energy
Learn from solar-cell experts (4)
Emerging Technology
Light-emitting materials printable on T-shirts

For further details visit at : techon.nikkeibp.co.jp/english/NMD/2009/200906.html